Network
FoodPackLab promotes the collaboration between international clusters and companies working in the food, packaging and photonics sectors in order to identify and develop solutions to challenges arising during the food processing and packaging stage that limit the food shelf life before being thrown out. Check out the involved network partners here, specified by their organisation type, domain and technologies.
IPE Etiquetas & Sleaves
Technology: Sensors, Lasers, Advanced Lighting, 3D Printing
Domain: Photonics, Food Packaging
Spain
More info
Branson Emerson
Technology: Sensors, Lasers, Advanced Lighting, 3D Printing
Domain: Food Packaging
Spain
More info
Instituto de Óptica – CSIC
Technology: Sensors, Lasers, Advanced Lighting
Domain: Photonics
Spain
More info
Laser 2000
Technology: Sensors, Lasers, Advanced Lighting, 3D Printing
Domain: Photonics
Spain
More info
Leitat Technological Center
Technology: Sensors, Advanced Lighting
Domain: Photonics, Food Processing
Spain
More info
Photon Lines Optica, SL
Technology: Sensors, Lasers, Advanced Lighting, 3D Printing
Domain: Photonics, Food Packaging
Spain
More info
Hamamatsu Photonics
Technology: Sensors, Lasers, Advanced Lighting
Domain: Photonics, Food Packaging
Japan
More info
KAO Chimigraf
Technology: Sensors, Lasers, Advanced Lighting, 3D Printing
Domain: Food Packaging
Spain
More info
This website was funded by the European Union’s COSME Programme (2014-2020)